Wafer Bonding formatIsbn:Softcover - 9783642059155 geadelt 1802

geadelt 1802

lieblose Erziehung ihrer Mutter und an den Vater

Fachbuch aus dem Jahr 2014 im Fachbereich BWL - Beschaffung

Die Samischgerberei

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Wafer Bonding formatIsbn:Softcover - 9783642059155 geadelt 1802During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state of the art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding based fabrication methods of silicon on insulator, photonic crystals, VCSELs, SiGe based FETs, MEMS together with hybrid integration and laser lift off. The non specialist will