Piergiacomi Manual Depaneling Tool to Separate PCB 1.0mm Blade ESD vendor_KINCROME Minimum vibration thanks to the

Minimum vibration thanks to the specially designed shaft

Brand Bernstein Product Type Wafer Tweezer Length 130 mm Weight 20 g Special Features With graduated lower paddle

They have been designed with comfort and ease of use in mind

perfect for use where it's not practical to use a full sized tool

Ideal gift set

Piergiacomi Manual Depaneling Tool to Separate PCB 1.0mm Blade ESD vendor_KINCROME Minimum vibration thanks to theOverview A manual depaneling tool designed to separate PCBs in a quick, economic and safe way, obtaining well finished cut surfaces; the maximum length of the isthmus (tab) should not exceed 3 mm. Grip model St. Also available in ESD safe version. Features Maximum PCB thickness: 1. 6mm Minimum isthmus distance: 11mm Maximum cutting force 1kg. Blade thickness: 1. 0mm Specifications Order code ESD Order code Maximum cutting force (kg) Blade thickness