Desco 12250 Statfree® High Density Foam, 6.4mm x 610mm x 914mm March Specials It contains high-temperature resistant compounds

It contains high-temperature resistant compounds that protect component-free areas during wave soldering

Dimensions Dimensions Small: 15

Chemical pads are non reactive to chemicals and absorbs up to 16 times its weight

High quality

CHANNELLOCK ® GL6 6

Desco 12250 Statfree® High Density Foam, 6.4mm x 610mm x 914mm March Specials It contains high-temperature resistant compoundsOverview High Density Foam is ideal for lead insertion packaging, providing ESD and physical protection to component leads, and bringing terminals to equipotential, minimizing exposure to discharge. Size: 24" x 36" Volume Resistivity: 10E3 10E5 ohms Surface Resistivity: 10E3 10E5 ohms Features Antistatic, low tribocharging Minimizes charge generation; material will conduct charges if grounded Dissipative corrosion resistant Ideal for long term storage